MS5168-M14
Introduction
The ZigBee module MS5168-Myy family is a range of ultra-low power, high performance surface mount modules designed for IEEE 802.15.4, JenNet-IP, ZigBee Light Link, ZigBee Smart Energy, and RF4CE networking applications. These ZigBee modules enable users to develop products with minimal time to market and at the lowest cost. by eliminating the need for expensive, time-consuming custom RF board designs and test suites.
The modules utilize NXP’s MS5168 wireless microcontroller, providing a comprehensive solution with large memory, high CPU and radio performance, and all RF components integrated. To develop and manufacture wireless control or sensing products, users only need to connect a power supply and peripherals such as switches, actuators, and sensors—significantly simplifying product development with the ZigBee module.
Variants
Table 1 Meshreen module variants
*1 FCC Certification Limitation:The high power module variants are classified as ‘mobile’ devices pursuant
with FCC § 2.1091 and must not be used at a distance of < 20 cm (8”) from any people. This applies to the
MS5168-M04 and MS5168-M05 module type (2AC2E-68M04).
*2 CE Certification Limitation: MS5168-M14 and MS5168-M05 CE tested under condition Power Level 2.
Specification
There are differences between modules, the parameters are defined here.
VDD=3.3V @ +25°C
Table 2 Module specification
Meshreen & NXP model compatible table
Meshreen’s modules are pin to pin compatible with NXP modules.
Documentation
Pin configurations
Note that the same basic pin configuration applies for all module designs.
However, DIO3(pin9) and DIO2(pin8) are not available on the high power modules.
Outline Drawing
Thickness: 2.8mm
Four corner of PCB are PCB V-Cut tolerance
Label example
Packing
For All models are packing in one size Tray, the Tray dimension is below.
The standard packing is base on 500 pcs, use 11 trays which include cover.
All modules will packing in vacuum packing bag which include trays, humidity indicator card, desiccant.
